P3067 IC Chip BGA Reballing Stencil Kits Set Solder Template Multi-Function CPU Tin Steel Net For I Phone 8
P3067 IC Chip BGA Reballing Stencil Kits Set Solder Template Multi-Function CPU Tin Steel Net For I Phone 8
Soldering Tools

P3067 IC Chip BGA Reballing Stencil Kits Set Solder Template Multi-Function CPU Tin Steel Net For I Phone 8

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Condition: New
Availability: In Stock
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SKU: B 302,TMD,Th,KRT

Rs.700 Rs. 875
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Ahsan jamshaid - March 26, 2021

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