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IC Chip BGA Reballing Stencil Kits Set Solder Template Multi-Function CPU Tin Steel Net For Samsung Note 6

Name: IC Chip BGA Reballing Stencil Kits Set Solder Template Multi-Function CPU Tin Steel Net For Samsung Note 6
SKU: B 302,TMD,Th,KRT
Price: 700 PKR
Availability: InStock
Rating: 5 (1 reviews)

(1 customer reviews)

Condition: New

Availability: In Stock

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SKU: B 302,TMD,Th,KRT

Rs.700 ~~Rs. 875~~

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SKU: B 302,TMD,Th,KRT
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Category: Tools
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Tags: IC Chip BGA Reballing Stencil Kits Set Solder Template Multi-Function CPU Tin Steel Net For Samsung Note 6

Based on 1 reviews

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Nona - March 26, 2021

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IC Chip BGA Reballing Stencil Kits Set Solder Template Multi-Function CPU Tin Steel Net For Samsung Note 6

Quantity

Based on 1 reviews

5

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