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IC Chip BGA Reballing Stencil Kits Set Solder MSM8917 MSM8937 BG161 BG221 in Pakistan

Condition: New
Availability: In Stock
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SKU: B 302

Rs.1000 Rs. 1250
What is Stencils:

A thin sheet of card, plastic, or metal with a pattern or letters cut out of it, used to produce the cut design on the surface below by the application of ink or paint through the holes.

what are BGA stencils

BGA rework stencils are manufactured from a polyimide film with a high-temperature adhesive covered with a release liner. It is the same type of material you have been using with bar code labels and for protecting gold fingers during the wave soldering process.

Suitable For:

11 in 1 BGA Reballing Stencil Template for Samsung Huawei MSM8917 MSM8937 BG161 BG221 BG160 BG167 BG166 BG254 BG162 BG186 BG169 eMMC BGA Reballing Stencil Template, High temperature resistant.

Package Include: 1XIC Chip BGA Reballing Stencil Kits Set Solder MSM8917 MSM8937 BG161 BG221 Pakistan

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